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China Wafer Level Csp Co Ltd

603005SHG

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CN¥31.69
-1.06%
End of day
Market Cap

$20.59B

P/E Ratio

55.39

Employees

1,088

Dividend Yield

0.38%

Price Chart

Risk-Adjusted Performance

Ratio1W1M3M6M1Y5YScore
Sortino22.9433.360.360.577.83
Calmar0.360.550.46
Sharpe5.1613.160.230.382.86
Omega3.452.591.081.101.54
Martin0.811.191.02
Ulcer0.611.3211.5111.979.09

China Wafer Level Csp Co Ltd (603005) Price Performance

China Wafer Level Csp Co Ltd (603005) trades on SHG in CNY. The company is classified in the Technology sector under the Semiconductors industry. The stock currently trades at CNY31.69, down 1.06% from the previous close.

Over the past year, 603005 has traded between a low of CNY25.56 and a high of CNY35.22. The stock has gained 14.2% over this period. It is currently 10.0% below its 52-week high.

China Wafer Level Csp Co Ltd has a market capitalization of $20.59B, with a price-to-earnings ratio of 55.39 and a dividend yield of 0.38%.

About China Wafer Level Csp Co Ltd

China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.

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Company Info

Exchange
SHG
Currency
CNY
Country
China

Financial Metrics

Revenue (TTM)
$1.47B
EBITDA
$519.24M
Profit Margin
25.08%
EPS (TTM)
0.57
Book Value
7.07

Technical Indicators

52 Week High
CN¥35.84
52 Week Low
CN¥25.28
50 Day MA
CN¥30.12
200 Day MA
CN¥29.75
Beta
0.54

Valuation

Trailing P/E
55.39
Forward P/E
N/A
Price/Sales
13.97
Price/Book
4.48
Enterprise Value
$18.30B